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Mitsubishi Electric Corporation launches MISOPTM (Mitsubishi Electric Intelligent Small Outline Power Module) surface-mount package intelligent power module (IPM) that will facilitate the implementation of low cost inverter systems, thanks to its compact and easily soldered package design. Introducing a well-arranged pin layout, integrated driver ICs and protection circuits, the new MISOP is expected to lead to inverter systems with smaller and simpler designed printed circuit board (PCB). In addition, PCB mounting using reflow soldering will allow easier and lower-cost assembly compared to products requiring through-hole mounting.
Custom Heat Sink Assemblies As a manufacturer of DC Power Supplies and a distributor of heat sinks, power semiconductors and clamps, Darrah Electric engineering is able to offer a complete line of air and water cooled heat sink assemblies. Find a standard or custom heat sink assembly in our full line for all common circuit configurations, including Diode/Rectifier, Thyristor/SCR, and IGBT circuits. Our experience with our product lines and the products we distribute allow us to offer practical and economical solutions to our customers so you can find the perfect heat sink assembly for your specific needs. Darrah engineering provides full 3D assembly drawings along with thermal calculations with our quotations. All heat sink assemblies are 100% tested prior to shipping. Full load testing with thermal data capture is available upon request for prototype or production products.
International Traffic in Arms Regulations (ITAR) is a United States regulatory regime to restrict and control the export of defense and military related technologies to safeguard U.S. national security and further U.S. foreign policy objectives. The U.S. Government requires all manufacturers, exporters, and brokers of defense articles, defense services or related technical data to be ITAR compliant.
SEMiX 6 features press-fit pin technology for the power and auxiliary terminals. Using solder-free mounting equipment, the 17-mm-high SEMiX product family is calculated to capitalize on the proficiency of our customers’ mounting methods. The SEMiX 6 structures the connection of all the terminals in a single manufacture step and completes the SEMIKRON commodity product portfolio.
125 mm LSS PLASTIC PACKAGED CONVERTOR THYRISTOR OF 5000V/4600AMPS RATING DEVELOPED FOR THE FIRST TIME IN INDIA BY RUTTONSHA IN COLLABORATION WITH S.P.C.O.
Dynex Presents New-Generation High-Power IGBT Modules, with Industry-Leading Performance
Advanced Power Devices for a Sustainable Future
As a part of our continuous improvement focus, Darrah Electric would like to invite you to participate in our Customer Satisfaction Survey. Our culture of continuous improvement stretches beyond internal processes and therefore we consider the opinion of our Customers and Partners a vital part of this ongoing process. Please take a moment to help us improve the customer service experience by filling out our short Customer Satisfaction Survey at: https://www.surveymonkey.com/r/DarrahElectric
IXYS Power MOSFETs are designed for RF applications below 100 MHz, linear applications, and high-power, high-frequency, and high-speed switching applications. These Power MOSFETs are available in a wide variety of typical industrial package choices for a broad spectrum of market needs, electrical design requirements, and mechanical and mounting specifications.
The HSW family is best matched for DC and AC currents measurement in high power and high voltage automotive applications. It features galvanic separation between the primary circuit (high power) and the secondary circuit (electronic circuit).
Anticipate More Modules - Production Capacity
Darrah Electric Company is proud to announce that it has received certification to the ISO 9001:2015 Quality Management System (QMS).