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Dual Inline Package IPM's (DIPIPM)

DIPIPMā„¢ is a high performance IPM used primarily for consumer use inverters with the advance of next generations using mounted chips or transfer mold construction, products from Ver. 4 provide even smaller size by using high thermal conductivity insulation sheets.
Mounting a high voltage IC (HVIC) with a built-in high voltage level shift circuit enables direct input of an input signal from the microcontroller, without using a photo coupler. Further mounting a bootstrap circuit allows operation of an independent power supply for the IGBT drive of the upper arm (P side) of a 3-phase inverter connection.

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