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Module Pasting Instruction Booklet

Application of Thermal Paste and Mounting Isolated Base Semiconductor Power Modules

Booklet Content
1. The necessity for thermal paste
2. Surface preparation and cleanliness of new or rebuilt heat sink assemblies
3. Supplies required for application
4. Application of paste using the screen printing method
5. Quality control check of thermal paste thickness
6. Mounting and torque sequence
7. Testing modules for good contact
8. Cleaning screen and other equipment